UNISEM-5005

UNISEM (M) BERHAD

Last Price: 8.16

TTM Dividend Yield : 0.74%

Coming Quarter Report: ~ 2021-04-29

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Sector: Semiconductors & Semiconductor Equipment

Unisem (M) Berhad is engaged in the manufacturing of semiconductor devices. The Company is a semiconductor assembly and test services provider in Malaysia. The Company offers a suite of assembly and test services, such as wafer bumping, wafer probing, wafer grinding, a range of leadframe and substrate integrated circuits packaging, wafer level chipscale packaging (CSP), flipchip and radio frequency, analog, digital and mixed-signal testing services. Its services include design, assembly, test, failure analysis, electrical and thermal characterization, warehousing and drop-ship services. The Company has approximately three semiconductor packaging and testing facilities located in Ipoh, Perak, Malaysia, Chengdu, People’s Republic of China (China), and Batam, Indonesia and over two wafer bumping facilities in Ipoh, Perak, Malaysia and Chengdu, China. It also has operations in the United Kingdom and the United States.

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Dividend

UNISEM Dividend Yield Trend

UNISEM Quarter DY Yield

UNISEM Annual DY Yield

Profit

UNISEM Quarter Report History

UNISEM Quarter Profit Trend

UNISEM Annual Profit Trend

Cash Flow

Cash Flow

In financial accounting, operating cash flow (OCF), cash flow provided by operations, cash flow from operating activities (CFO) or free cash flow from operations (FCFO), refers to the amount of cash a company generates from the  revenues it brings in, excluding  costs associated with long – term  investment  on capital items or investment in securities.(From Wiki)

UNISEM Annual Cash Flow



			

0 Comments

  1. Unisem (M) Bhd provides semiconductor assembly and test services in Malaysia. Its packaging and testing facilities are located in Ipoh, Perak, Malaysia, Chengdu, China, and Batam, Indonesia; and wafer bumping facilities in Ipoh, Perak, Malaysia and Chengdu, China. Unisem’s assembly and test services include wafer bumping, wafer probing, wafer grinding, a range of leadframe and substrate integrated circuits packaging, wafer level CSP (chipscale packaging), flipchip and radio frequency, analog, digital and mixed-signal testing services. Its turnkey services include design, assembly, test, failure analysis, electrical and thermal characterization, warehousing and drop-ship services. The company has its business presence in Asia, Europe and the United States of America.

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